Apparatus and method for cutting electrode foil layers

Cutting – Processes

Reexamination Certificate

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C083S169000, C083S684000

Reexamination Certificate

active

08033202

ABSTRACT:
A punch and die apparatus and a method and apparatus for punching a capacitor electrode layer. A method includes placing a capacitor material sheet between a punch and a die, the punch guided by a punch guide, there being no stripper plate between the punch guide and the die, and actuating the punch to punch an electrode layer out of the sheet. An apparatus includes a die having a die hole, a punch guide, and a punch located within the punch guide. The punch guide and the die have a fixed distance therebetween such that there is no compression on a work piece placed between the die and the punch before the punch contacts the workpiece.

REFERENCES:
patent: 1471669 (1923-10-01), Miller
patent: 1734024 (1929-10-01), Wright
patent: 2821156 (1958-01-01), Lyon
patent: 3288715 (1966-11-01), Klint et al.
patent: 3550491 (1970-12-01), Wingard
patent: 3710666 (1973-01-01), Keyes et al.
patent: 3724247 (1973-04-01), Page
patent: 3800643 (1974-04-01), Scott et al.
patent: 3980541 (1976-09-01), Aine
patent: 4052249 (1977-10-01), Bruce et al.
patent: 4225553 (1980-09-01), Hirota et al.
patent: 4361020 (1982-11-01), Hirota et al.
patent: 4413500 (1983-11-01), Myer
patent: 4425829 (1984-01-01), Kranik et al.
patent: 4609597 (1986-09-01), Plasse
patent: 4627256 (1986-12-01), Myer
patent: 4631020 (1986-12-01), Frankenberg et al.
patent: 4756717 (1988-07-01), Sturgis et al.
patent: 4821614 (1989-04-01), Fleet et al.
patent: 4872381 (1989-10-01), Stroms
patent: 4977804 (1990-12-01), Naito
patent: 5214991 (1993-06-01), Shimizu et al.
patent: 5226226 (1993-07-01), Fierkens
patent: 5230712 (1993-07-01), Matthews
patent: 5241991 (1993-09-01), Iorio
patent: 5259225 (1993-11-01), Koch
patent: 5325583 (1994-07-01), Shimizu et al.
patent: 5361660 (1994-11-01), Tsubota
patent: 5660737 (1997-08-01), Elias et al.
patent: 5678439 (1997-10-01), Dunwoody et al.
patent: 5775060 (1998-07-01), Ferrero
patent: 5791217 (1998-08-01), Dundas et al.
patent: 5922215 (1999-07-01), Pless et al.
patent: 6006133 (1999-12-01), Lessar et al.
patent: 6042624 (2000-03-01), Breyen et al.
patent: 6113753 (2000-09-01), Washburn
patent: 6120015 (2000-09-01), Albright et al.
patent: 6207001 (2001-03-01), Steidinger et al.
patent: 6409776 (2002-06-01), Yan et al.
patent: 6447175 (2002-09-01), Ogawa
patent: 6550987 (2003-04-01), Ogawa
patent: 6571126 (2003-05-01), O'Phelan et al.
patent: 6603654 (2003-08-01), Rorvick
patent: 6678559 (2004-01-01), Breyen et al.
patent: 6699265 (2004-03-01), O'Phelan et al.
patent: 6763749 (2004-07-01), Droste et al.
patent: 6772663 (2004-08-01), Machamer
patent: 2002/0186977 (2002-12-01), Ogawa
patent: 2005/0220926 (2005-10-01), Naito et al.
patent: 2008/0053185 (2008-03-01), Morgan et al.
3M, Fluorinert Electronic Liquid FC-43, May 2000.
“U.S. Appl. No. 11/468,666, Restriction Requirement mailed Jan. 21, 2009”, 8 pgs.
“U.S. Appl. No. 11/468,666, Non-Final Office Action mailed May 11, 2009”, 8 pgs.
“U.S. Appl. No. 11/468,666, Non-Final Office Action mailed May 11, 2009”, 8 pgs.
“U.S. Appl. No. 11/468,666, Response filed Jan. 8, 2009 to Restriction Requirement mailed Dec. 8, 2008”, 9 pgs.
“U.S. Appl. No. 11/468,666, Response filed Feb. 23, 2009 to Restriction Requirement mailed Jan. 21, 2009”, 8 pgs.
“U.S. Appl. No. 11/468,666, Response filed Aug. 10, 2009 to Non Final Office Action mailed May 11, 2009”, 10 pgs.
“U.S. Appl. No. 11/468,666, Restriction Requirement mailed Jan. 21, 2009”, 8 pgs.
“U.S. Appl. No. 11/468,666, Examiner Interview Summary mailed Jan. 21, 2009”, 3 pgs.
“U.S. Appl. No. 11/468,666, Examiner Interview Summary mailed Sep. 8, 2010”, 3 pgs.
“U.S. Appl. No. 11/468,666, Final Office Action mailed Nov. 12, 2009”, 9 pgs.
“U.S. Appl. No. 11/468,666, Final Office Action mailed Nov. 24, 2010”, 17 pgs.
“U.S. Appl. No. 11/468,666, Non-Final Office Action mailed Jun. 8, 2010”, 13 pgs.
“U.S. Appl. No. 11/468,666, Response filed Oct. 6, 2010 to Non-Final Office Action mailed Jun. 8, 2010”, 13 pgs.
“U.S. Appl. No. 11/468,666, Response filed Feb. 10, 2010 to Final Office Action mailed Nov. 12, 2009”, 10 pgs.
“U.S. Appl. No. 11/468,666, Response filed Mar. 24, 2011 to Final Office Action mailed Nov. 24, 2010”, 14 pgs.

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