Apparatus and method for cutting a wiring pattern

Details Apparatus and method for cutting a wiring pattern Apparatus and method for cutting a wiring pattern

1983-03-30

1985-07-30

Albritton, C. L.

Electric heating

Metal heating

By arc

219121LJ, 219121FS, B23K 2600

Patent

active

045324018

ABSTRACT:
An apparatus for cutting a faulty spot or area of a predetermined wiring pattern by radiating a laser beam and which includes a reset table in which a wafer chip is fixed in place on a support table. A radiating device is disposed above the rest table to permit the laser beam to be directed at the wiring pattern. A positioning device is connected to the radiating device to position the laser beam. Between the radiating device and the support table a cover is disposed to define a hermetically-sealed space including the wafer chip. A hole of the cover is coupled to a vacuum pump. After the space is placed in a vacuum the laser beam is radiated toward the wiring pattern to permit the portion of the wiring pattern to be cut.

REFERENCES:
patent: 3560258 (1971-02-01), Brisbane
patent: 3584183 (1971-06-01), Chiaretta
patent: 4190854 (1980-02-01), Redfern
North et al., IEEE Journal of Solid-State Circuits, "Laser Coding of Bipolar Read-Only Memories", vol. SC-11, No. 4, pp. 500-504, Aug. 1976.

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