Fishing – trapping – and vermin destroying
Patent
1994-10-18
1996-02-27
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437 8, 437189, 437192, H01L 2160
Patent
active
054948568
ABSTRACT:
A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.
REFERENCES:
patent: 4360142 (1982-11-01), Carpenter et al.
patent: 4526859 (1985-07-01), Christensen et al.
patent: 4740099 (1988-04-01), Philipoussi
patent: 4792532 (1988-12-01), Ohtani et al.
patent: 4870224 (1989-09-01), Smith et al.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5052481 (1991-10-01), Horvath et al.
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5173451 (1992-12-01), Kinsman et al.
patent: 5237269 (1993-08-01), Aimi et al.
patent: 5268072 (1993-12-01), Agarawala et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5298459 (1994-03-01), Arikawa et al.
patent: 5334804 (1994-08-01), Love et al.
patent: 5376584 (1994-12-01), Agarwala
patent: 5447264 (1995-09-01), Koopman et al.
P. J. Lueck, IBM Technical Disclosure Bulletin, vol. 36, No. 03, Mar. 1993, "Burn-in/In Situ Testing of Computer Chips".
E. Anemojanis, et al., IBM Technical Disclosure Bulletin, vol. 34, No. 8, Jan. 1992, "Wafer Level Test and Burn-In".
Beaumont Guy D.
Labbe Denis
Warren Alain
Ahsan Aziz M.
Hearn Brian E.
International Business Machines - Corporation
Picardat Kevin M.
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