Apparatus and method for creating detachable solder connections

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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437189, G01R 104

Patent

active

055743862

ABSTRACT:
A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.

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P. J. Lueck, IBM Technical Disclosure Bulletin, vol. 36, No. 03, Mar. 1993, "Burn-in/In Situ Testing of Computer Chips".
E. Anemojanis, et al., IBM Technical Disclosure Bulletin, vol. 34, No. 8, Jan. 1992, "Wafer Level Test and Burn-In".

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