Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1995-06-05
1996-11-12
Wieder, Kenneth A.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
437189, G01R 104
Patent
active
055743862
ABSTRACT:
A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.
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E. Anemojanis, et al., IBM Technical Disclosure Bulletin, vol. 34, No. 8, Jan. 1992, "Wafer Level Test and Burn-In".
Beaumont Guy D.
Labbe Denis
Warren Alain
Ahsan Aziz M.
Bowser Barry C.
International Business Machines - Corporation
Wieder Kenneth A.
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