Apparatus and method for cooling semiconductor devices

Details Apparatus and method for cooling semiconductor devices Apparatus and method for cooling semiconductor devices

2007-02-20

2007-02-20

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S714000

Reexamination Certificate

active

10853432

ABSTRACT:
An apparatus and method for cooling semiconductor devices. A cooling system for semiconductor devices is disclosed and includes a semiconductor substrate, horizontal channels and a cooling medium. Specifically, the semiconductor substrate is incorporated into a die. Also, one or more horizontal channels are formed in a backside of the semiconductor substrate of the die. The horizontal channels collect thermal energy that is generated by electrical components located on a front side of the semiconductor substrate. A cooling medium circulates within the one or more horizontal channels for transferring the thermal energy away from the die.

REFERENCES:
patent: 5901037 (1999-05-01), Hamilton et al.
patent: 6521516 (2003-02-01), Monzon et al.
patent: 6704200 (2004-03-01), Zeighami et al.
patent: 2004/0145047 (2004-07-01), Kim et al.
Anthony Cataldo, EE Times; Startup puts cold water on hot CPUs; Oct. 9, 2003; http://www.eetimes.com/story/OEG20031006S0021 ; pp. 2.

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