Apparatus and method for cooling semiconductor devices

Details Apparatus and method for cooling semiconductor devices Apparatus and method for cooling semiconductor devices

2007-09-25

2007-09-25

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S714000, C029S890035

Reexamination Certificate

active

11594584

ABSTRACT:
An apparatus and method for cooling semiconductor devices. A cooling system for semiconductor devices is disclosed and includes a semiconductor substrate, horizontal channels and a cooling medium. Specifically, the semiconductor substrate is incorporated into a die. Also, one or more horizontal channels are formed in a backside of the semiconductor substrate of the die. The horizontal channels collect thermal energy that is generated by electrical components located on a front side of the semiconductor substrate. A cooling medium circulates within the one or more horizontal channels for transferring the thermal energy away from the die.

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