Apparatus and method for cooling integrated circuit devices

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S695000, C361S697000, C361S699000, C257S715000, C174S015200, C165S080400, C165S104260, C165S104330, C062S259400

Reexamination Certificate

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06917522

ABSTRACT:
Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

REFERENCES:
patent: 4819011 (1989-04-01), Yokota
patent: 5737923 (1998-04-01), Gilley et al.
patent: 6003319 (1999-12-01), Gilley et al.
patent: 6233944 (2001-05-01), Yamada et al.
patent: 2003/0218865 (2003-11-01), Macias

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