Apparatus and method for cooling a semiconductor substrate

Details Apparatus and method for cooling a semiconductor substrate Apparatus and method for cooling a semiconductor substrate

2005-07-26

2005-07-26

Ciric, Ljiljana (Department: 3753)

Heat exchange

Structural installation

C165S080400, C165S185000, C156S345520, C156S345530, C118S724000

Reexamination Certificate

active

06920915

ABSTRACT:
A cooling stage for a semiconductor substrate and a method for utilizing such cooling stage for cooling of a semiconductor substrate. In the cooling stage, a pedestal that has a substantially planar top surface is equipped with a first plurality of circular grooves concentrically formed in the top surface and a second plurality of linear grooves formed in radial directions emanating from a center of the top surface in fluid communication with the first plurality of circular grooves to allow a cooling fluid to flow therethrough when a semiconductor substrate is positioned on the top surface of the stage.

REFERENCES:
patent: 6019164 (2000-02-01), Getchel et al.
patent: 6032724 (2000-03-01), Hatta
patent: 6073681 (2000-06-01), Getchel et al.
patent: 6081414 (2000-06-01), Flanigan et al.
patent: 6138745 (2000-10-01), Moslehi

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