Apparatus and method for controlling the depth of immersion of a

Details Apparatus and method for controlling the depth of immersion of a Apparatus and method for controlling the depth of immersion of a

1998-02-06

2000-03-21

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438119, H01L 2144, H01L 2148, H01L 2150

Patent

active

060402059

ABSTRACT:
A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

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