Abrading – Abrading process – Glass or stone abrading
Patent
1999-01-29
2000-09-05
Banks, Derris H.
Abrading
Abrading process
Glass or stone abrading
451289, B24B 100
Patent
active
06113466&
ABSTRACT:
An apparatus and a method for controlling a polishing profile on a substrate during a polishing process are disclosed. In the apparatus for controlling the polishing profile on a silicon wafer during a CMP process, an elastic plate that has sufficient rigidity is used as a backing plate for a wafer to be polished. By deforming the elastic plate with a contour adjusting device, the curvature of the substrate to be polished can be changed from being convex to being concave, or vice versa. The present invention novel apparatus and method therefore allows the achievement of a more uniform thickness profile after a polishing process. The present invention novel method and apparatus farther allows an in-situ control of the curvature of a elastic plate during polishing and thus a specific thickness profile on the substrate surface.
REFERENCES:
patent: 4918869 (1990-04-01), Kitta
patent: 5643053 (1997-07-01), Shendon
patent: 5651724 (1997-07-01), Kimura et al.
patent: 5766058 (1998-06-01), Lee et al.
patent: 5820448 (1998-10-01), Shamouilian et al.
patent: 5882243 (1999-03-01), Das et al.
patent: 5913719 (1999-06-01), Hasegawa et al.
Banks Derris H.
Taiwan Semiconductor Manufacturing Co. Ltd.
LandOfFree
Apparatus and method for controlling polishing profile in chemic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for controlling polishing profile in chemic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for controlling polishing profile in chemic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2206676