Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2002-11-26
2004-10-12
Koehler, Robert R. (Department: 1775)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C204S279000, C205S083000, C205S084000, C205S096000
Reexamination Certificate
active
06802950
ABSTRACT:
TECHNICAL FIELD
This description of embodiments of an invention generally relates to electroplating systems and more particularly, to an improved shielding apparatus and method to improve the electric field current distribution in electroplating systems.
SUMMARY
In accordance with one embodiment of the present invention, an electroplating system capable of controlling the thickness of a metal film electrodeposited onto a substrate is provided. The electroplating system includes a standard electroplating apparatus and a non-conductive shield having a certain size and one or more aperture openings that is disposed in the electroplating apparatus to selectively alter or modulate the electric field between the anode and the plating surface in this embodiment and thereby control the electrodeposition rate across the area of the plating surface.
The shield is disposed between the anode and the cathode. As a result, the electric field is modulated so that a desired time-averaged electric field current-density is applied to every point on the plating surface. Because the electrodeposition rate depends in part on the characteristics of the electric field, the uniformity of the thickness profile of the electrodeposited metal can be manipulated by the size of the shield and of the shield aperture(s).
REFERENCES:
patent: 6027631 (2000-02-01), Broadbent
patent: 6103085 (2000-08-01), Woo et al.
patent: 6254742 (2001-07-01), Hanson et al.
patent: 6413388 (2002-07-01), Uzoh et al.
Chalupa, R.; Cao, Y.; West, A. C.: “Unsteady Diffusion Effects in Electrodeposition in Submicron Features,”Journal of Applied Electrochemistry, v.32, p135-143 (2002), (no month given).
Cao, Y.; Taephaisitphongse, P.; Chalupa, R.; West, A.C.: “A Three-Additive Model of Superfilling of Copper,”Journal of the Electrochemical Society, v.148, (7) pp. C466-C472 (2001), (no month given).
Hachman, Jr. John T.
Kelly James J.
West Alan C.
Evans Timothy P.
Koehler Robert R.
Sandia National Laboratories
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