Apparatus and method for controlling plating induced stress in e

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204 3, 204 7, 204 141, 204 19, 204406, 204434, G01N 2742

Patent

active

046489444

ABSTRACT:
Internal stress on an object being electroplated is monitored continuously with a gauge. The gauge includes a metal receptor which is employed as a second cathode in the electrodeposition process. A separate plating current is supplied between the anode and second cathode, distinct from the separately controllable current between the anode and object being plates or electroformed. The stress on the second cathode is measured with a strain gauge, and a stress deviation from a desired plating stress is determined. The currents between the anode and first and second cathodes are adjusted in accordance with the measured internal stress on the metal receptor to achieve a desired stress condition.
The internal stress is advantageously monitored with a foil resistance strain gauge. The strain gauge is connected to a carrier disposed in parallel with the metal receptor. The carrier is rigidly connected at opposite ends to the metal receptor. A stress transmission link centrally located between ends of the metal receptor and the carrier transmits the force applied by the electroplating material on the receptor to the carrier. The strain gauge provides an indication of the stress which results from the electroplating. The currents between the anode and first and second cathodes may be controlled in accordance with this stress measurement.

REFERENCES:
patent: 2568713 (1951-09-01), Brenner
patent: 2829517 (1958-04-01), Kushner
patent: 3215609 (1965-11-01), Chapdelaine
patent: 3356597 (1967-12-01), Schmidt
patent: 3356605 (1967-12-01), Schmidt
patent: 3437568 (1969-04-01), Hasselmann et al.
patent: 3570449 (1971-03-01), Blecherman et al.
patent: 4086153 (1978-04-01), Arigz et al.
patent: 4479980 (1984-10-01), Acorta et al.
"The Origins of Stress in Electrodeposits I, II & III, "Weil, AES Research Project 22.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for controlling plating induced stress in e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for controlling plating induced stress in e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for controlling plating induced stress in e will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1020468

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.