Chemistry: electrical and wave energy – Processes and products
Patent
1985-07-18
1987-03-10
Chapman, Terryence
Chemistry: electrical and wave energy
Processes and products
204 3, 204 7, 204 141, 204 19, 204406, 204434, G01N 2742
Patent
active
046489444
ABSTRACT:
Internal stress on an object being electroplated is monitored continuously with a gauge. The gauge includes a metal receptor which is employed as a second cathode in the electrodeposition process. A separate plating current is supplied between the anode and second cathode, distinct from the separately controllable current between the anode and object being plates or electroformed. The stress on the second cathode is measured with a strain gauge, and a stress deviation from a desired plating stress is determined. The currents between the anode and first and second cathodes are adjusted in accordance with the measured internal stress on the metal receptor to achieve a desired stress condition.
The internal stress is advantageously monitored with a foil resistance strain gauge. The strain gauge is connected to a carrier disposed in parallel with the metal receptor. The carrier is rigidly connected at opposite ends to the metal receptor. A stress transmission link centrally located between ends of the metal receptor and the carrier transmits the force applied by the electroplating material on the receptor to the carrier. The strain gauge provides an indication of the stress which results from the electroplating. The currents between the anode and first and second cathodes may be controlled in accordance with this stress measurement.
REFERENCES:
patent: 2568713 (1951-09-01), Brenner
patent: 2829517 (1958-04-01), Kushner
patent: 3215609 (1965-11-01), Chapdelaine
patent: 3356597 (1967-12-01), Schmidt
patent: 3356605 (1967-12-01), Schmidt
patent: 3437568 (1969-04-01), Hasselmann et al.
patent: 3570449 (1971-03-01), Blecherman et al.
patent: 4086153 (1978-04-01), Arigz et al.
patent: 4479980 (1984-10-01), Acorta et al.
"The Origins of Stress in Electrodeposits I, II & III, "Weil, AES Research Project 22.
Engelhaupt Darell E.
George Ronald W.
Irlesberger Kurt H.
Michaud Lawrence L.
Ohmart James G.
Chapman Terryence
Chin Gay
Iseman William J.
Martin Marietta Corporation
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