Apparatus and method for controlling plasma size and position in

Details Apparatus and method for controlling plasma size and position in Apparatus and method for controlling plasma size and position in

1993-05-13

1995-09-12

Kunemund, Robert

Coating apparatus

Gas or vapor deposition

With treating means

118723MW, 118723ME, 31511121, 333159, 333 99PL, C23C 1630, C23C 1650

Patent

active

054494125

ABSTRACT:
A block of dielectric material having a long axis and a short axis and having low losses at a selected microwave frequency and a dielectric constant selected to produce a desired degree of phase modulation is mounted on a rotatable shaft in an orientation perpendicular to the long and short axes and arranged inside a waveguide feeding a CVD reactor containing a plasma species. The block is spun by a rotational force applied to the shaft at an angular acceleration such that the two axes of the block successively intersect the axis of the waveguide within the decay period of the plasma species. The frequency of phase modulation can be varied by changing the angular acceleration of the shaft, and the amplitude of the phase modulation can be varied by changing the ratio of block length to thickness and/or by selecting a material with higher dielectric constant. The incident microwave power may be modulated as a function of angular position of the spin shaft. By moving the apparent plasma and modulating the applied microwave power, a customized temperature profile may be achieved over a desired substrate area.

REFERENCES:
patent: 2716221 (1955-08-01), Allen
patent: 4420729 (1983-12-01), Ashforth
patent: 4613836 (1986-09-01), Evans
patent: 4877509 (1989-10-01), Ogawa et al.
patent: 4909184 (1990-03-01), Fujiyama
patent: 4989542 (1991-02-01), Kamo
patent: 5188862 (1993-02-01), Itatani et al.
patent: 5271971 (1993-12-01), Herb et al.
patent: 5276386 (1994-01-01), Watanabe et al.

Affiliated with

Also associated with

Rating

Apparatus and method for controlling plasma size and position in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for controlling plasma size and position in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for controlling plasma size and position in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-403593