Metal founding – Process – Shaping liquid metal against a forming surface
Patent
1997-06-13
1999-10-26
Pyon, Harold
Metal founding
Process
Shaping liquid metal against a forming surface
164113, 164324, 164452, 1641554, 164137, B22D 3304
Patent
active
059710586
ABSTRACT:
An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.
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Bolde Lannie R.
Covell II James H.
Ahsan Aziz M.
International Business Machines - Corporation
Lin I.-H.
Pyon Harold
Tomaszewski John J.
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