Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2011-03-01
2011-03-01
Stoner, Kiley (Department: 1735)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S004500, C228S180500
Reexamination Certificate
active
07896218
ABSTRACT:
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed and claimed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.
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Potham Jeerasak
Rakpongsiri Pornchai
Stoner Kiley
Western Digital Technologies Inc.
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