Apparatus and method for cold welding thin wafers to hard substr

Details Apparatus and method for cold welding thin wafers to hard substr Apparatus and method for cold welding thin wafers to hard substr

1995-02-16

1996-08-27

Heinrich, Samuel M.

Metal fusion bonding

Process

Using only pressure

228208, 228 31, 118 50, 118500, B23K 2016, B23K 2024

Patent

active

055492371

ABSTRACT:
An apparatus for coating and bonding parts in a vacuum includes a floating mount assembly holding one part and applying a bonding load to the parts. A pivoting mount assembly holds one part and is pivoted between a coating position and a bonding position. At least one coating source is provided for depositing a thin film of a metal onto a surface of each of the parts to improve the cold weld between the two parts. A restraining lever controls the application of the bonding load to the parts. The coating and bonding process occurs in a vacuum chamber with a single set-up.

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patent: 5148958 (1992-09-01), Eskandari et al.
patent: 5186379 (1993-02-01), Helber, Jr.
patent: 5279724 (1994-01-01), Rauch et al.

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