Apparatus and method for clip-on attachment of heat sinks to enc

Details Apparatus and method for clip-on attachment of heat sinks to enc Apparatus and method for clip-on attachment of heat sinks to enc

1997-04-28

1999-04-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361705, 361707, 361709, 257706, 257712, 257717, 257718, 257719, 257687, H05K 720

Patent

active

058985719

ABSTRACT:
An encapsulated semiconductor package assembly including a substrate, a die operatively disposed on the substrate, a lid for support by the substrate over the die, a heat sink operatively on the lid and a releasable clip which clips the heat sink releasably to the lid. With the encapsulant over the die but not yet solidified, the lid is pressed down into the encapsulant and onto the substrate. Thereby when the encapsulant is cured the lid is held in place on the substrate. The clip clips onto a lip or a slot of the lid to releasably hold a heat sink on the lid for dissipating heat from the die. The lip can be formed by an overhanging portion of the lid, and the slot can be formed in a side wall of the lid.

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