Apparatus and method for cleaning surfaces of semiconductor...

Details Apparatus and method for cleaning surfaces of semiconductor... Apparatus and method for cleaning surfaces of semiconductor...

2006-05-30

2006-05-30

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

C134S05600D, C134S094100, C134S095300, C134S102200, C134S137000, C134S144000, C134S157000, C134S184000, C134S198000, C134S902000

Reexamination Certificate

active

07051743

ABSTRACT:
An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

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