Abrading – Abrading process – Utilizing fluent abradant
Reexamination Certificate
1998-08-11
2001-04-24
Rose, Robert A. (Department: 3723)
Abrading
Abrading process
Utilizing fluent abradant
C451S039000, C451S060000, C451S075000, C451S080000, C451S089000, C134S002000
Reexamination Certificate
active
06220935
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus and a method for cleaning a substrate, and in particular, to an apparatus and a method for cleaning a substrate which is applicable to a semi-conducter wafer, a glass substrate for a liquid crystal display (LCD) or for a plasma display panel (PDP), etc.
2. Description of the Related Art
Conventionally, a semi-conducter wafer,and a glass substrate for LCD or PDP has been cleaned mechanically or chemically. More specifically, the substrate has been cleaned by utilizing the combination of a brush, which includes a protruded shape made of PVA, etc., with medicinal liquid and the like. In particular, in a case where the substrate is cleaned after a metallic film and an oxidized film are formed on the substrate, or after the substrate is polished chemically and mechanically, the oxidized film can be etched by a great amount of hydrofluoric acid and then cleaned off. However, in most cases, the substrate has been cleaned by a brush. Further, in a case where a resist residue which remains on the substrate is to be removed after it is ashed, the resist is cleaned off by a mixed liqud of sulfuric acid and another medicinal liquid, while on the other hand, in a case where metallic fractions are to be removed from the oxidized film, the metallic fractions are cleaned off by a mixed liquid of hydrochloric acid and another liquid.
The cleaning of the substrate by the brush causes several kinds of problems, for instance, mechanical damage to the substrate, the need to frequently replace the brush due to the fact that the foreign objects which have entered into, or have been entrapped to the brush cannot be completely removed, and the difficulty in adjusting the degree of parallelization of a line formed by tip of the brush against the surface of the wafer.
Further, in a case where the semi-conducter wafer or the glass substrate is to be cleaned by the brush, rubbish, the foreign objects, or particles can be entrapped into the brush to be attached thereto, which results in the incomplete cleaning of the semi-conducter wafer or the glass substrate.
Furthermore, in a case where the semi-conducter wafer or a glass substrate is to be cleaned without using the brush after CMP, there is a problem that the rubbish, foreign objects, and particles can not be completely removed unless it is etched by a large amount of hydrofluoric acid.
In addition, as described above, the resist after it is ashed is removed by a mixed liquid of sulfuric acid and another medicinal liquid, however, it cannot be removed completely through such a chemical reaction. Therefore, it is removed through some processes in each of which a large amount of medicinal liquid is used, which has the disadvantage of increasing the amount of work.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an apparatus or a method for cleaning the substrate which is capable of cleaning the substrate very well without using a brush.
It is another object of the present invention to provide an apparatus or a method for cleaning the substrate which is capable of cleaning the substrate to a high degree by completely removing rubbish, etc. without using a large amount of hydrofluoric acid or medicinal liquid.
The above objects are achieved according to the present invention by providing an apparatus for cleaning a substrate comprising cleaning chambers each of which is disposed on a respective side with reference to a clearance therebetween, chuck means for clamping the substrate to be cleaned and moving the substrate between the inside of the clearance between the cleaning chambers and the outside thereof, screw means each of which is disposed to be rotatable and close to a respective surface of the substrate when the substrate is introduced into the clearance between the cleaning chambers, liquid supplying means for supplying the screw means with pure water or mixed liquid including pure water and medicinal liquid; and snow ice supplying means for supplying the screw means with snow ice having a predetermined granular diameter, whereby the opposite surfaces of the substrate are cleaned by the screw means rotating pure water or mixed liquid including pure water and medicinal liquid, and snow ice so as to press it against the opposite surfaces of the substrate.
The above objects are achieved according to the present invention by providing a method for cleaning a substrate to be cleaned in cleaning chambers each of which is disposed on a respective side with reference to a clearance therebetween, the method comprising the steps of moving the substrate toward the clearance between the cleaning chambers, supplying the area close to the opposite surfaces of the substrate with pure water or mixed liquid including pure water and medicinal liquid and snow ice having a predermined granular diameter; and cleaning the opposite surfaces of the substrate by rotating the pure water or mixed liquid including pure water and medicinal liquid, and snow ice to press it against the opposite surfaces of the substrate.
The above objects are achieved according to the present invention by providing a method for cleaning a substrate to be cleaned in cleaningchambers each of which is disposed on a respective side with reference to a clearance therebetween, the method comprising the steps of moving the substrate toward the clearance between the cleaning chambers, supplying the area close to at least one surface of the substrate with pure water or mixed liquid including pure water and medicinal liquid and snow ice having a predetermined granular diameter; and supplying the area close to the one surface of the substrate with the snow ice having a predetermined granular diameter, cleaning the one surface of the substrate by rotating the pure water or mixed liquid including pure water and medicinal liquid, and snow ice to press it against the one surface of the substrate.
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Furusawa Masami
Harano Riichiro
Jacobson Price Holman & Stern PLLC
Nguyen George
Rose Robert A.
Sprout Co., Ltd.
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