Apparatus and method for cleaning semiconductor wafers

Cleaning and liquid contact with solids – Processes – With treating fluid motion

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

134 21, 134 34, 134902, B08B 700, B08B 704

Patent

active

061464694

ABSTRACT:
The present invention relates to an apparatus and method for cleaning post-etch semiconductor wafers using ultra-pure dry steam.

REFERENCES:
patent: 4079522 (1978-03-01), Ham
patent: 4186032 (1980-01-01), Ham
patent: 4546726 (1985-10-01), Nagasaka et al.
patent: 5105556 (1992-04-01), Kurokawa et al.
patent: 5174855 (1992-12-01), Tanaka
patent: 5248380 (1993-09-01), Tanaka
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5314846 (1994-05-01), Boitnott
patent: 5735962 (1998-04-01), Hillman
patent: 5964952 (1999-10-01), Kunze-Concewitz

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for cleaning semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for cleaning semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for cleaning semiconductor wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2061579

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.