Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1997-03-19
1999-07-20
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
118728, 118729, 156345, 269245R, C23C 1450
Patent
active
059252260
ABSTRACT:
An apparatus is disclosed for clamping a substrate or wafer with a predetermined force during a sputtering process for maintaining a minimal gap between the wafer and a backplane in order to provide a uniform temperature distribution on the wafer. The apparatus includes a first suspension system which includes a diaphragm having a plurality of spring sections positioned in contact with an outer peripheral area of an upper surface of the wafer. The spring sections are positioned immediately adjacent to each other to provide substantially continuous and uniform loading of the outer periphery in order to eliminate edge gaps. The apparatus further includes a second suspension system which includes a mounting ring having a plurality of springs each of which are secured to a fixed element. The first and second suspension systems are configured such that approximately 80 to 90% of the total spring deflection is provided by the second suspension system whereas the remaining 10 to 20% of the total spring deflection is provided by the first suspension system.
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Hurwitt Steven
Jelinek Vaclav
McDonald Rodney G.
Nguyen Nam
Tokyo Electron Limited
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