Apparatus and method for chemical mechanical polishing process

Details Apparatus and method for chemical mechanical polishing process Apparatus and method for chemical mechanical polishing process

2005-08-02

2005-08-02

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000, C451S057000, C451S063000, C451S067000, C451S285000, C451S287000

Reexamination Certificate

active

06923710

ABSTRACT:
An apparatus and method for chemical mechanical polishing are disclosed. An example apparatus for use with a chemical mechanical polishing (CMP) process includes a polishing part configured to perform a CMP process to a polishing endpoint for a polishing target deposited on a substrate, a cleaning part configured to clean the substrate, and a resistance measurement part configured to measure a sheet resistance of the substrate. The example apparatus also includes a CMP control part configured to determine based on the sheet resistance whether a residual target exists, to estimate re-polishing time, and to control the polishing part to perform a re-polishing process if the residual target exists.

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