Apparatus and method for chemical mechanical polishing of a wafe

Abrading – Abrading process – Glass or stone abrading

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Details

451246, 451285, 451287, 451298, B24B 2902

Patent

active

060010010

ABSTRACT:
In a polishing configuration wherein a polishing material or slurry is applied to a surface of a rotating polishing pad and a product material mounted on a rotating carrier is moved into contact with the polishing material or slurry, the flow of the polishing material or slurry over the surface can be improved by fabricating spiral grooves or channels in the surface of the polishing pad and by mounting the product material is a cavity of the carrier, the cavity having grooves or channels in the side walls to provide a uniform flow over the product material. The angle between the spiral grooves or channels on the polishing pad and a diameter about the axis of rotation should be approximately 40.degree.. The spiral grooves or channels on the polishing pad can be combined with concentric grooves or channels to further improve the flow of polishing material. Similarly, the grooves or channels in the rotating carrier provide further uniformity for the interaction of the polishing material and the product material. As with the grooves or channels in the polishing pad, the grooves or channels in the side walls of the carrier cavity have an optimum angle of 40.degree. with respect to the diameter, centered on the axis of rotation of the carrier, passing through the groove or channel.

REFERENCES:
patent: 5779526 (1998-07-01), Gill
patent: 5842910 (1998-12-01), Krywanczyk
patent: 5851140 (1998-12-01), Barns
patent: 5876273 (1999-03-01), Yano

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