Abrading – Machine – Rotary tool
Reexamination Certificate
2006-04-18
2006-04-18
Rachuba, M. (Department: 3723)
Abrading
Machine
Rotary tool
C451S287000
Reexamination Certificate
active
07029381
ABSTRACT:
A chemical mechanical polishing system having a wafer carrier assembly is provided. The wafer carrier assembly includes a wafer carrier support frame, a wafer carrier head housing rotable mounted on the wafer carrier support frame, with a base including a bladder bellows operating connecting the wafer carrier base to the wafer carrier head housing such that rotational torque is transferred from the wafer carrier head housing to the wafer carrier base. Further provided is a retaining ring, operatively connected to a retaining ring bearing which allows relative axial motion while constraining relative radial motion between the retaining ring and the wafer carrier head housing; and a retaining ring bellows, operatively connecting the retaining ring bearing to urge the retaining ring against a polishing member. A chamber formed by the bladder bellows, the wafer carrier base and the wafer carrier head housing may be pressurized to load the wafer carrier base against a polishing member, independent of any frictional loads on the retaining ring.
REFERENCES:
patent: 4959113 (1990-09-01), Roberts
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5676587 (1997-10-01), Landers et al.
patent: 5716258 (1998-02-01), Metcalf
patent: 5770103 (1998-06-01), Wang et al.
patent: 5835225 (1998-11-01), Thakur
patent: 5838448 (1998-11-01), Aiyer et al.
patent: 5840629 (1998-11-01), Carpio
patent: 5851140 (1998-12-01), Barns et al.
patent: 5897375 (1999-04-01), Watts et al.
patent: 5916015 (1999-06-01), Natalicio
patent: 5916016 (1999-06-01), Bothra
patent: 5953115 (1999-09-01), Landers et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5964643 (1999-10-01), Birang et al.
patent: 5964653 (1999-10-01), Perlov et al.
patent: 5972787 (1999-10-01), Boggs et al.
patent: 5980367 (1999-11-01), Metcalf
patent: 5985679 (1999-11-01), Berman
patent: 5985748 (1999-11-01), Watts et al.
patent: 5993302 (1999-11-01), Chen et al.
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6004187 (1999-12-01), Nyui et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6036587 (2000-03-01), Tolles et al.
patent: 6046111 (2000-04-01), Robinson
patent: 6056632 (2000-05-01), Mitchel et al.
patent: 6062133 (2000-05-01), Blalock
patent: 6062952 (2000-05-01), Robinson et al.
patent: 6063306 (2000-05-01), Kaufman et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6068549 (2000-05-01), Jackson
patent: 6071177 (2000-06-01), Lin et al.
patent: 6074287 (2000-06-01), Miyaji et al.
patent: 6077452 (2000-06-01), Litvak
patent: 6179956 (2001-01-01), Nagahara et al.
patent: 6204922 (2001-03-01), Chalmers
patent: 6206768 (2001-03-01), Quek
patent: 6238590 (2001-05-01), Fischer et al.
patent: 6257953 (2001-07-01), Gitis et al.
patent: 6290577 (2001-09-01), Shendon et al.
patent: 6290584 (2001-09-01), Kim et al.
patent: 0881484 (1998-12-01), None
patent: WO 99/02304 (1999-01-01), None
Adams, et al.,“Process Control and Endpoint Detection with Fullscan ISRM System in Chemical Mechanical Polishing of Cu Layers,” CMP-MIC, Mar. 2000, 5 pages.
Bonner et al.,“Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films,” MRS, Spring 2000, 6 pages.
Garretson et al.,“New Pad Conditioning Disk Design Delivers Excellent Process Performance While Increasing CMP Productivity,” CMP Technology for ULSI Interconnection, SEMICON West 2000, 9 pages.
Osterheld et al.,“A Novel Retaining Ring in Advanced Polishing Head Design for Significantly Improved CMP Performance,” MRS, Apr. 5-9, 1999, 8 pages.
Römer et al.,“STI CMP Using Fixed Abrasive Demands, Measurement Methods and Results,” CMP-MIC, Mar. 2000, 10 pages.
Surana et al., “Defectivity Reduction in Copper CMP Processes,” VMIC, Jun. 2000, 3 pages.
Tang, et al.,“Novel Integrated Single Wafer Immersion Megasonics for Advanced Post CMP Cleaning in a Next Generation Dry-in-Dry-out CMP System,” CMP-MIC, Mar. 2000, 5 pages.
Melvin Jason
Oh Hilario L.
Suh Nam P.
Aviza Technology Inc.
Dorsey & Whitney LLP
Rachuba M.
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