Apparatus and method for chamfering wafer with loose abrasive gr

Details Apparatus and method for chamfering wafer with loose abrasive gr Apparatus and method for chamfering wafer with loose abrasive gr

1997-08-20

1999-08-31

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451285, 451 43, B24B 100

Patent

active

059445840

ABSTRACT:
Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, is disposed in a place, the polisher having a periphery shaping edge on a peripheral side surface, wherein the polishing device is moved in a radial direction of the wafer so as to position the periphery shaping edge close to the periphery of the wafer, and the wafer and the polishing device are rotated relatively to each other, while slurry containing suspension of abrasive grains is supplied to a narrow space therebetween from a slurry supply nozzle.

REFERENCES:
patent: 888129 (1908-05-01), Tone
patent: 1736355 (1929-11-01), Mosher
patent: 3916579 (1975-11-01), Waller et al.
patent: 4344260 (1982-08-01), Ogiwara
patent: 4718202 (1988-01-01), Worsham
patent: 5149337 (1992-09-01), Watanabe
patent: 5274959 (1994-01-01), Dyer et al.
patent: 5295331 (1994-03-01), Honda et al.
patent: 5317836 (1994-06-01), Hasegawa et al.
patent: 5476413 (1995-12-01), Hasegawa et al.
patent: 5609514 (1997-03-01), Yasunaga et al.
patent: 5658185 (1997-08-01), Morgan, III et al.
patent: 5658189 (1997-08-01), Kagamida
patent: 5664990 (1997-09-01), Adams et al.
patent: 5725414 (1998-03-01), Moinpour et al.

Affiliated with

Also associated with

Rating

Apparatus and method for chamfering wafer with loose abrasive gr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for chamfering wafer with loose abrasive gr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for chamfering wafer with loose abrasive gr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2424713