Apparatus and method for carrier backing film reconditioning

Details Apparatus and method for carrier backing film reconditioning Apparatus and method for carrier backing film reconditioning

1995-02-02

1996-09-24

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

134 991, 1341032, 1341041, 134201, B08B 302

Patent

active

055581110

ABSTRACT:
An apparatus and method for cleaning and reconditioning a wafer carrier backing film. The apparatus comprises a flat perforated surface plate with a perforated film or perforated embossed glass plate on its surface; a backing plate connected to the surface plate which is fitted for connection to a cleaning solution supply and a vacuum source; and a contacting mechanism for extension/retraction of the surface plate until it contacts the carrier backing film. Following a wafer unload cycle, the carrier backing film is reconditioned by spraying a cleaning solution at the carrier backing film so as to rinse slurry deposits from the film material; extending the surface plate to make sealed contact with the wafer carrier; initiating a vacuum condition to press the carrier backing film and draw out slurry residuals and excessive water content from within the film; and retracting the surface plate to reconstitute the film as the material draws in surrounding air to break the vacuum condition.

REFERENCES:
patent: 4466852 (1984-08-01), Beltz et al.
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patent: 5180431 (1993-01-01), Suginoto et al.
patent: 5230184 (1993-07-01), Bukhman
patent: 5246525 (1993-09-01), Sato
patent: 5320706 (1994-06-01), Blackwell
patent: 5349978 (1994-09-01), Sago et al.
patent: 5351360 (1994-10-01), Suzuki et al.
patent: 5487398 (1996-01-01), Ohmi et al.

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