Apparatus and method for calibrating a wafer blade

Geometrical instruments – Gauge – Straightness – flatness – or alignment

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Details

33303, G01M 1900, G01C 902

Patent

active

061639729

ABSTRACT:
A calibration tool for calibrating the leveling and tilting of a wafer transporting blade and a method for using such tool are provided. The calibration tool is constructed by a body portion and a leg portion each having a surface that are provided with a multiplicity of calibration lines facing each other such that a two-dimensional calibration can be performed on a blade simultaneously by positioning the blade between the body portion and the leg portion. The capability of measuring a plane, i.e., leveling and tilting, simultaneously is a great benefit made possible by the present invention method and apparatus.

REFERENCES:
patent: 4566192 (1986-01-01), Hankins et al.
patent: 5454170 (1995-10-01), Cook
patent: 5557855 (1996-09-01), Hwang
patent: 5970807 (1999-10-01), Hsu et al.

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