Apparatus and method for bonding multiple dice

Details Apparatus and method for bonding multiple dice Apparatus and method for bonding multiple dice

2009-11-17

2010-12-07

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S005500, C228S008000, C228S106000, C228S180210, C228S234100

Reexamination Certificate

active

07845543

ABSTRACT:
An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.

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