Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2006-02-07
2006-02-07
Paik, Sang (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C228S180100
Reexamination Certificate
active
06995342
ABSTRACT:
Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.
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Fukada Kazuki
Hosotani Naoto
Watanabe Katsuhiko
Yamauchi Hiroshi
Matsushita Electric - Industrial Co., Ltd.
Paik Sang
Wenderoth , Lind & Ponack, L.L.P.
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