Apparatus and method for automatically forming unitary bonded bo

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156216, 156226, 156350, 156353, 156479, 156486, 156522, 156552, 493947, B32B 3100

Patent

active

047642408

ABSTRACT:
This invention is for an apparatus and method for automatically forming unitary bonded board structures from a source of boards and a single continuous piece of tape. In one embodiment of this invention board pairs are automatically fed into the machine. In another embodiment a gusset is automatically formed in the unitary bonded board structure without scoring the tape. The method and machine operate automatically on the boards and tape for the most part in an in-line arrangement travelling along a horizontal plane in one direction that is about thirty inches off the floor so that the entire operation can be observed and controlled by a single operator.

REFERENCES:
patent: 846123 (1907-03-01), Mehle
patent: 1574789 (1926-03-01), Burgess
patent: 1769391 (1930-07-01), Reutener
patent: 1971892 (1934-08-01), Anderson et al.
patent: 2088805 (1937-08-01), Olm et al.
patent: 2346874 (1944-04-01), Russell
patent: 2645795 (1953-07-01), Pitner
patent: 2649674 (1953-08-01), Bartelt
patent: 2977271 (1961-03-01), Lutwack
patent: 2991214 (1961-07-01), Burkholder
patent: 3029073 (1962-04-01), Wright
patent: 3092532 (1963-06-01), Swick
patent: 3127165 (1964-03-01), Denny et al.
patent: 3273913 (1966-09-01), Mullen
patent: 3284982 (1966-11-01), Conti
patent: 3416285 (1968-12-01), Standley et al.
patent: 3604182 (1971-09-01), Jepson
patent: 3622425 (1971-11-01), Savarick
patent: 4004962 (1977-01-01), Kleid
patent: 4008650 (1977-02-01), Alter et al.
patent: 4147380 (1979-04-01), Nelson
patent: 4441950 (1984-04-01), Lolli
patent: 4559030 (1985-12-01), Tada
patent: 4586917 (1986-05-01), Robinson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for automatically forming unitary bonded bo does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for automatically forming unitary bonded bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for automatically forming unitary bonded bo will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-598985

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.