Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2005-05-17
2005-05-17
Werner, Brian (Department: 2822)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
06895109
ABSTRACT:
An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.
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Schemmel Floyd
Thorne Richard
Brady III Wade James
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Werner Brian
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