Apparatus and method for automatically detecting defects on...

Image analysis – Applications – Manufacturing or product inspection

Reexamination Certificate

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Reexamination Certificate

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06895109

ABSTRACT:
An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.

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