Coating processes – Measuring – testing – or indicating
Patent
1997-01-28
1998-01-20
Beck, Shrive
Coating processes
Measuring, testing, or indicating
427 96, 427282, 118669, 118406, 118413, 118504, 101129, 101484, B05D 132, B05C 1102, B05C 320
Patent
active
057099057
ABSTRACT:
A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.
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Adams Dale R.
Shaw Michael F.
Suppelsa Anthony J.
Beck Shrive
Gold Glenn E.
Motorola Inc.
Parker Fred J.
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