Apparatus and method for automatic monitoring and control of a s

Details Apparatus and method for automatic monitoring and control of a s Apparatus and method for automatic monitoring and control of a s

1994-10-17

1996-04-23

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

22818022, 2282481, 21912162, H05K 334

Patent

active

055095976

ABSTRACT:
Apparatus and method for soldering a first material to a second material uses a laser and involves applying solder paste over the first material, placing the second material on the solder paste in alignment with the first material to form a sample, and focusing a laser beam onto a predetermined location on the sample to segment the solder paste and form a solder joint between the first material and the second material. During the soldering, optical images of at least one region-of-interest in the solder paste adjacent the solder joint are captured. Formation of the solder joint is monitored by repeatedly calculating pixel value sums in the region-of-interest from the optical images to determine whether the solder paste in the region-of-interest has segmented. Control signals may be generated based on the pixel value sums and used to adjust at least one of the intensity and duration of the laser beam.

REFERENCES:
patent: 3803413 (1974-04-01), Vanzetti et al.
patent: 4481418 (1984-11-01), Vanzetti et al.
patent: 4531044 (1985-07-01), Chang
patent: 4657169 (1987-04-01), Dostoomian et al.
patent: 4893742 (1990-01-01), Bullock
patent: 4914272 (1990-04-01), Ito et al.
patent: 4963714 (1990-10-01), Adamski et al.
patent: 4980971 (1991-01-01), Bartschat et al.
patent: 4988202 (1991-01-01), Nayar et al.
patent: 5023426 (1991-06-01), Prokosch et al.
patent: 5055652 (1991-10-01), Jones et al.
patent: 5064291 (1991-11-01), Reiser
patent: 5122635 (1992-06-01), Knodler et al.
patent: 5185811 (1993-02-01), Beers et al.
patent: 5233152 (1993-08-01), Prokosch et al.

Affiliated with

Also associated with

Rating

Apparatus and method for automatic monitoring and control of a s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for automatic monitoring and control of a s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for automatic monitoring and control of a s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2303438