Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-03-03
2008-11-04
Nguyen, Ha (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S1540PB
Reexamination Certificate
active
07446542
ABSTRACT:
An apparatus for testing flip-chip packages has a programmed computer, a test-engine stage for applying an impact to at least one package under test, and a monitoring stage. The test-engine stage causes an impact on the package on the side opposite its ball-grid array. The test-engine stage has actuators connected to the test-engine stage and the computer, for moving and aligning the test-engine stage. The monitoring stage has a digital camera connected to the computer for transmitting digital images from the ball-grid array side of the package to the computer. A microscope is preferably connected to the digital camera. A sample stage located between the test-engine stage and the monitoring stage holds the package under test. The sample stage has an acoustic transducer capable of being removably connected to the package under test. The acoustic transducer is connected to the computer for transmitting signals from the acoustic transducer to the computer.
REFERENCES:
patent: 5319977 (1994-06-01), Quate et al.
patent: 5412997 (1995-05-01), Hu et al.
patent: 5438402 (1995-08-01), Gupta
patent: 5852232 (1998-12-01), Samsavar et al.
patent: 5992242 (1999-11-01), Murphy et al.
patent: 6877365 (2005-04-01), Watanabe et al.
patent: 2004/0181304 (2004-09-01), Collier
patent: 2004/0217767 (2004-11-01), DiOrio et al.
patent: 2005/0026476 (2005-02-01), Mok et al.
patent: 2006/0096385 (2006-05-01), Wenski
patent: 2006/0097727 (2006-05-01), Messenger et al.
patent: 2006/0104561 (2006-05-01), Ivtsenkov
patent: 2006/0108896 (2006-05-01), Nanataki et al.
patent: 2006/0108897 (2006-05-01), Nanataki et al.
patent: H02-126255 (1992-01-01), None
patent: H05-0065450 (1994-05-01), None
patent: WO 2004/083831 (2004-09-01), None
Wong, E.J., et al, Drop Impact: Fundamentals and Impact Characterisation of Solder Joints, Instron Corporation, Norwood, Massachusetts, USA, May 19, 2005.
Teo, Mary et al, Correlation of Material Properties to Reliability Performance of Anisotropic Conductive Adhesive Flip Chip Packages, IEEE Transactions on Components and Pack.
Gupta, V., et al, Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique, Confer.
Miller, M. R., Laser Spallation Adhesion Metrology for Electronic Packaging Development, Electronic Components and Technology Conference Proceedings from the 26th ISTFA, 2000.
Gupta, V., Measurement of Interfacial Adhesion and its Degradation in Multi-layer Packages, Devices, and Blanket Films using the Laser Spallation Technique, Conference Proceed.
Wong, E. H., et al, Tackling Drop Impact Realiability of Electronic Packaging, International Electronic Packaging Technical Conference and Exhibition (IPACK2003-35100), Maui, H.
Physics and Chemistry of Solids, Rain Erosion Apparatus [online]. Cavendish Laboratory, Madingley Road, Cambridge CB3 0HE, UK [retrieved on Mar. 04, 2006]. Retrieved from the I.
Wagner, L.C., Mechanical Testing in IC Packaging, Characteriztion of Integrated Circuit Packaging Materials, Moore, Thomas M., et al, eds., 1993, pp. 243-246, Butterworth-Hein.
Sharma, R, et al, Solder-Bumped Flip Chip Interconnect Technologies: Materials, Processes, Performance, and Reliability, Characterization of Integrated Curcuit Packaging Mate.
Newman, Keith, BGA Brittle Fracture—Alternative Solder Joint Integrity Test Methods, pp. 1194-1201, Proc. 55th Electronic Components and Technology Conference, May 31, 2005.
Wong, E.H., et al., “Drop Impact: Fundamentals and Impact Characterisation of Solder Joint,” Instron Corporation, Norwood, Massachusetts, USA, May 19, 2005.
Teo, Mary, et al., “Correlation of Materials Properties to Reliability Performance of Anisotropic Conductive Adhesive Flip Chip Packages”, IEEE Transactions on Components and Packaging Technologies, vol. 28, No. 1, Mar. 2005.
Gupta, V., et al., “Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique”, Conference Proceedings from the 30thISTFA, 2004, pp. 267-276, ASM International, USA.
Miller, Mikel R., et al., “Laser Spallation Adhesion Metrology for Electronic Packaging Development”, Electronic Components and Technology Conference Proceedings, 2002, The Printing House, USA.
Gupta, Vijay, et al, “Measurement of Interfacial Adhesion and its Degradation in Multi-layer Packages, Devices, and Blanket Films using the Laser Spallation Technique”, Conference Proceedings from the 26thISTFA, 2000, pp. 25-33, ASM International, USA.
Wong, E. H., et al., “Tackling Drop Impact Reliability of Electronic Packaging,” International Electronic Packaging Technical Conference and Exhibition (IPACK2003-35101), Maui, Hawaii, USA, Jul. 6-11, 2003.
Physics and Chemistry of Solids, “Rain Erosion Apparatus” [online]. Cavendish Laboratory, Madingley Road, Cambridge CB3 0HE, UK. [retrieved on Mar. 04, 2006], Retrieved from the Internet: <URL: http://www-pcs.phy.cam.ac.uk/fsp/oldpage.html> (access “Rain Erosion” link).
Wagner, L.C., Mechanical Testing in IC Packaging, Characterization of Integrated Circuit Packaging Materials, Moore, Thomas M., et al, eds., 1993, pp. 243-246, Butterworth-Heinemann, Manning, USA.
Sharma, R., et al., Solder-Bumped Flip Chip Interconnect Technologies: Materials, Processes, Performance, and Reliability, Flip Chip Technologies, 1995, pp. 123-153, McGraw-Hill, USA.
International Searching Authority, International Application No. PCT/US06/007700, International Search Report and the Written Opinion, Feb. 20, 2007.
International Preliminary Examining Authority, Application No. PCT/US06/07700, International Preliminary Report on Patentability, Jul. 3, 2007.
Moore Thomas M.
Zaykova-Feldman Lyudmila
Nguyen Ha
Nguyen Tung X
Omniprobe, Inc.
Thomas John A.
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