Apparatus and method for arranging semiconductor pellets

Details Apparatus and method for arranging semiconductor pellets Apparatus and method for arranging semiconductor pellets

1982-09-22

1984-08-14

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156238, 156241, 156233, 156552, 29430, 29559, 269903, B44C 114, B65C 900, B21D 3903, B23Q 318

Patent

active

044655436

ABSTRACT:
An apparatus transposes a matrix of semiconductor pellets mounted on a first adhesive tape to a second adhesive tape in such a manner that the respective pellet rows are arranged spaced from the adjacent pellet rows. It has pellet-supporting means having an inclined plane and apical plane. The first adhesive tape bearing the matrix is carried stepwise along the inclined plane toward the apical plane to successively bring the respective rows of the matrix to the apical plane. Above the apical plane, a second adhesive tape is carried in a direction intersecting the pellet columns at right angles with the adhesive plane thereof facing the matrix. When each row mounted on the first tape is on the apical plane, the second tape is pressed against the row. Each time one pellet row is transposed to the second tape, the pellet-supporting means is shifted in a direction intersecting the pellet columns at right angles.

REFERENCES:
patent: 3708372 (1973-01-01), Coatreras
patent: 3715258 (1973-02-01), Cunnane
patent: 3743558 (1973-07-01), Ludwig
patent: 3785903 (1974-01-01), Boyer et al.
patent: 3894633 (1975-07-01), Egan et al.
patent: 4021292 (1977-05-01), Bates et al.
patent: 4029536 (1977-06-01), Kovacs et al.
patent: 4061521 (1977-12-01), Lerner et al.
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4239576 (1980-12-01), Taki et al.
patent: 4291867 (1981-09-01), Williams et al.
Avins, RCA Technical Notes No. 802, Nov. 27, 1968, RCA Publ., Princeton, NJ (5 sheets).

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