Apparatus and method for arranging magnetic solder balls

Details Apparatus and method for arranging magnetic solder balls Apparatus and method for arranging magnetic solder balls

2010-07-09

2010-12-21

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S248100, C228S245000, C228S223000, C438S612000, C438S613000, C118S213000

Reexamination Certificate

active

07854367

ABSTRACT:
An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

REFERENCES:
patent: 07-283521 (1995-10-01), None
patent: 2004-311886 (2004-11-01), None
patent: 2006-005276 (2006-01-01), None
patent: 2007-125794 (2007-05-01), None

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