Metal fusion bonding – With means to handle work or product – Including means to orient work or position work portion...
Reexamination Certificate
2005-12-12
2010-06-01
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
With means to handle work or product
Including means to orient work or position work portion...
C228S212000, C029S759000
Reexamination Certificate
active
07726540
ABSTRACT:
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
REFERENCES:
patent: 3466514 (1969-09-01), Brunner et al.
patent: 3775644 (1973-11-01), Cotner et al.
patent: 4270267 (1981-06-01), Bakermans
patent: 4316321 (1982-02-01), Wickham
patent: 4860439 (1989-08-01), Riley
patent: 5688127 (1997-11-01), Staab et al.
patent: 5850689 (1998-12-01), Mogi et al.
patent: 5911257 (1999-06-01), Morikawa et al.
patent: 5932065 (1999-08-01), Mitchell
patent: 5974654 (1999-11-01), Morita
patent: 6043667 (2000-03-01), Cadwallader et al.
patent: 6190997 (2001-02-01), Becker et al.
patent: 6338297 (2002-01-01), Wang et al.
patent: 6354480 (2002-03-01), Higashi et al.
patent: 6398098 (2002-06-01), Kada
patent: 6422452 (2002-07-01), Yamamoto et al.
patent: 6550662 (2003-04-01), Too
patent: 6635308 (2003-10-01), Forrest et al.
patent: 6708965 (2004-03-01), Nuxoll et al.
patent: 6760968 (2004-07-01), Mimata et al.
patent: 6899262 (2005-05-01), Gaunekar et al.
patent: 6945381 (2005-09-01), Miura et al.
patent: 7258703 (2007-08-01), Cheng et al.
patent: 2003/0017629 (2003-01-01), Tsui et al.
patent: 2003/0042626 (2003-03-01), Howarth
patent: 2004/0035913 (2004-02-01), Ball
patent: 2005/0126028 (2005-06-01), Lim et al.
patent: 2006/0278683 (2006-12-01), Otsuka et al.
patent: 08078417 (1996-03-01), None
Chan See Lok
Cheng Chi Wah
Mak Tim Wai Tony
Tang Hoi Shuen Joseph
ASM Assembly Automation Ltd.
Gamino Carlos
Ostrolenk Faber LLP
Ward Jessica L.
LandOfFree
Apparatus and method for arranging devices for processing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for arranging devices for processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for arranging devices for processing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4161196