Apparatus and method for applying solder flux to a printed circu

Details Apparatus and method for applying solder flux to a printed circu Apparatus and method for applying solder flux to a printed circu

1982-02-16

1987-11-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 20, 228 37, 228223, 118 63, 427348, H05K 334, B23K 120

Patent

active

047082810

ABSTRACT:
In a wave soldering apparatus including a station for forming a standing wave of foamed flux, a preheater station, and a standing wave of hot molten solder station, a flux removing apparatus for reducing the thickness of flux on a coated printed circuit board includes an apertured pipe for gently blowing a plurality of streams of air against the foam coated board, the streams acting effectively as a continuous linear stream of air. The airstreams also blow the foamed flux into apertures in the printed circuit board.

REFERENCES:
patent: 3439854 (1969-04-01), Walker
patent: 3500536 (1970-03-01), Goldschmied

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