Apparatus and method for application of hot-melt resin adhesive

Details Apparatus and method for application of hot-melt resin adhesive Apparatus and method for application of hot-melt resin adhesive

1973-11-15

1976-04-27

Tollberg, Stanley H.

Dispensing

With heating or cooling means

Cooling only

222399, 219421, 219424, 220 67, B67D 562

Patent

active

039529215

ABSTRACT:
Apparatus and method for the application of a hot-melt resin adhesive wherein an enclosed chamber having a restricted discharge orifice is provided with a valve element for opening and closing said orifice; a non-oxidizing gas is introduced into the chamber at super-atmospheric pressure with a charge of resin adhesive, and heat is applied uniformly to the chamber to cause the adhesive to attain a viscous, flowable condition. The gas under super-atmospheric pressure forces a portion of the flowable resin through the orifice when the valve element is in open position.

REFERENCES:
patent: 1878709 (1932-09-01), Kerr
patent: 2564427 (1951-08-01), Rugeris
patent: 2773496 (1956-12-01), Czarnecki
patent: 2795461 (1957-06-01), Durkin
patent: 2839653 (1958-06-01), Kane
patent: 3161756 (1964-12-01), Haverkamp et al.
patent: 3332581 (1967-07-01), Estabrooks
patent: 3708088 (1973-01-01), Lesher
patent: 3764045 (1973-10-01), Ornsteen

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