Apparatus and method for alignment of a bonding tool

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control

Reexamination Certificate

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Details

C156S360000, C156S351000, C073S001150, C073S862324

Reexamination Certificate

active

10762826

ABSTRACT:
The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.

REFERENCES:
patent: 5985064 (1999-11-01), Sato
patent: 6179938 (2001-01-01), Mannhard et al.
patent: 6347555 (2002-02-01), Namerikawa et al.
patent: 6523423 (2003-02-01), Namerikawa et al.
patent: 2002-170831 (2002-06-01), None
Mizutani Kenji. Machine Translation of JP2002-170831 from JPO database. Jun. 14, 2002. All pages.

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