Apparatus and method for aligning wafers

Work holders – Relatively movable jaws – Jaw features

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

214 1BS, 214152, 269 21, 269 58, 294 64R, 29271, 29406, 29743, 29759, 219121L, 219121LM, 219158, B65G 4790

Patent

active

041414560

ABSTRACT:
The device includes an alignment station at which an operator can align a wafer under a microscope. Once the wafer is properly aligned, a transfer chuck is brought into position above the wafer and aligned with alignment pins located in fixed positions at the alignment station. The wafer is then fixed to the transfer chuck and released from the alignment station. The transfer chuck is moved into proper alignment with alignment pins at a remote operation station, such as an automatic scribing station. The invention allows the operator to view the wafer with semiconductor devices facing the operator and provides for flipping the wafer over through the use of the transfer chuck so that the laser scriber can scribe the wafer on the side away from the semiconductor devices.

REFERENCES:
patent: 3272350 (1966-09-01), Pflaumer et al.
patent: 3611561 (1971-12-01), Dosier
patent: 3816700 (1974-06-01), Weiner et al.
patent: 4042119 (1977-08-01), Hassan et al.
Keen et al.,--"Photosensitive System For Orienting a Translucent Substrate"--Digest #21-Western Electric, Jan. 1971 --pp. 17-19.
Finu et al.--"Bernoulli Wafer Load & Unloading System"--pp. 427 and 428--vol. 16, No. 2, Jul. 1973 IBM Tech. Disc.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for aligning wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for aligning wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for aligning wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-718868

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.