Apparatus and method for aligning surface mountable electronic c

Metal working – Method of mechanical manufacture – Electrical device making

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29741, 174 524, 228 11, 228 561, 2281802, 357 74, H05K 339, B23P 1900

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048317241

ABSTRACT:
A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder coated pads, melting the solder and vibrating the leads relative to the pads while the solder is molten, so that the surface tension of the molten solder centers the leads on the pads. The molten solder is then cooled until it resolidifies.

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Area Array Solder Interconnections for VLSI, Solid State Technology, vol. 26, No. 6, Jun. 1983.

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