Apparatus and method for aligning solder pads during head...

Details Apparatus and method for aligning solder pads during head... Apparatus and method for aligning solder pads during head...

2008-03-18

2008-03-18

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S049100, C228S180210

Reexamination Certificate

active

10951496

ABSTRACT:
A device for orienting an integrated lead suspension tail during a head gimbal assembly soldering operation of a head stack assembly process is disclosed. The device includes a body portion and at least one pin extending from the body portion. The pin(s) is configured to position the integrated lead suspension tail proximate to a main flex cable such that electrical coupling between the integrated lead suspension tail and the main flex cable is established upon completion of said head gimbal assembly soldering operation. The pin(s) has sufficient length to extend past a terminal end of the main flex cable.

REFERENCES:
patent: 4050469 (1977-09-01), Lin
patent: 5574234 (1996-11-01), Schudel
patent: 5637807 (1997-06-01), Kliewer et al.
patent: 5832764 (1998-11-01), Girard
patent: 5927295 (1999-07-01), Quinones
patent: 6493187 (2002-12-01), Pace et al.
patent: 6848167 (2005-02-01), Mita et al.
patent: 6891700 (2005-05-01), Shiraishi et al.
patent: 2004/0257708 (2004-12-01), Erpelding
patent: 2005/0209797 (2005-09-01), Anderson et al.

Affiliated with

Also associated with

Rating

Apparatus and method for aligning solder pads during head... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for aligning solder pads during head..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for aligning solder pads during head... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3906824