Apparatus and method for air-cooling an electronic assembly

Details Apparatus and method for air-cooling an electronic assembly Apparatus and method for air-cooling an electronic assembly

1998-06-18

2000-10-17

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165908, H05K 720

Patent

active

061341088

ABSTRACT:
An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.

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"Burn-In Fixture for Moduler", IBM Tech Discl. Bulletin, vol. 27, No. 7B, Dec. 1984.

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