Apparatus and method for achieving mechanical and thermal isolat

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437211, 437214, 437217, 437219, 437228, 437927, 437974, H01L 2160

Patent

active

055082319

ABSTRACT:
A preferred embodiment of an integrated semiconductor device includes a semiconductor die having a hole therethrough. A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend the paddle member in the hole. A cap layer is bonded to the semiconductor die to completely cover the hole, the paddle member, and the handle member. The second surface of the semiconductor die is bonded to the lead frame. A preferred embodiment of a method of manufacturing an integrated semiconductor device includes the steps of: forming a semiconductor die having a paddle area for isolating sensitive circuitry and an unoccupied area which substantially surrounds the paddle area except for a handle area, forming a trench in the unoccupied area, covering the paddle area, the trench, and the handle area with a sacrificial spacer material, covering the sacrificial spacer material with a cap layer, etching the semiconductor die beneath the paddle area and the trench until the handle area suspends the paddle area within a hole formed in the semiconductor die, and bonding the second surface of the semiconductor die to a lead frame.

REFERENCES:
patent: 3585416 (1971-06-01), Mellen
patent: 4571661 (1986-02-01), Hoshino
patent: 4672411 (1987-06-01), Shimizu et al.
patent: 4696188 (1987-09-01), Higashi
patent: 4706374 (1987-11-01), Murakami
patent: 4772928 (1988-09-01), Dietrich et al.
patent: 4774633 (1988-09-01), DeHaine et al.
patent: 4849071 (1989-07-01), Evans et al.
patent: 4864383 (1989-09-01), Gloton et al.
patent: 4892842 (1990-01-01), Corrie et al.
patent: 4910582 (1990-03-01), Miyamoto et al.
patent: 4990986 (1991-02-01), Murakami et al.
patent: 4996411 (1991-02-01), Rebjock
patent: 5006487 (1991-04-01), Stokes
patent: 5037782 (1991-08-01), Nakamura et al.
patent: 5045503 (1991-09-01), Kobiki et al.
patent: 5051379 (1991-09-01), Bayer et al.
patent: 5059543 (1991-10-01), Wise et al.
patent: 5103279 (1992-04-01), Gutteridge
patent: 5115292 (1992-05-01), Takebe et al.
patent: 5129983 (1992-07-01), Greiff
patent: 5138414 (1992-08-01), Shinohara
patent: 5155061 (1992-10-01), O'Connor et al.
patent: 5202281 (1993-04-01), Ishibashi
patent: 5242863 (1993-09-01), Xiang-Zheng et al.
patent: 5272374 (1993-12-01), Kodai et al.
patent: 5283459 (1994-02-01), Hirano et al.
Richard J. Reay, Emo H. Klaassen, Gregory T. A. Kovacs, "TA 9.: A Micromachined Low-Power Temperature-Regulated Bandgap Voltage Reference," ISSCC95/Session 9/Integrated Sensors and Circuits/Paper TA 9.7, 1995 IEEE International Solid-State Circuits Conference, 1995 Digest of Technical Papers, vol. 38, ISSN 0193-6530, pp. 166-167 and 359 (1995).
Frank Goodenough, "Heated Actuator Self-Tests .+-.50-G Accelerometer IC", Electronic Design, Jun. 25, 1992, pp. 107-110.
Brian Link, "Field-Qualified Silicon Accelerometers: From 1 Milli g to 200,000 g", Sensors, Mar. 1993, pp. 28-33.
Egbert Spiegel, M. Kandler, Y. Manoli, and W. Mokwa, "TA7.5: A CMOS Sensor and Signal Conversion Chip for Monitoring Arterial, Blood Pressure and Temperature" 1992 IEEE International Solid-State Circuits Conference, ISSCC 92, Paper 7.5, pp. 126-127, & 264.
Mark Gottschalk, "Thin-Film NI-TI Alloy Powers Silicon Microvalve", Design News, Jul. 19, 1993, pp. 67-68.
Frank Goodenough, "Capacitance-Based Acceleration Sensor Combines Bulk and Surface Micromachining", Electric Design, date unknown, pages unknown.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for achieving mechanical and thermal isolat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for achieving mechanical and thermal isolat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for achieving mechanical and thermal isolat will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-324958

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.