Apparatus, and corresponding method, for stress testing wire bon

Details Apparatus, and corresponding method, for stress testing wire bon Apparatus, and corresponding method, for stress testing wire bon

1998-09-24

1999-11-30

Karlsen, Ernest

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 1073, G01R 3102

Patent

active

059949104

ABSTRACT:
An apparatus, and a corresponding method, for stress-testing wire bond-type semiconductor chips is disclosed. The apparatus includes a clamp housing, with a spring-loaded screw extending through the top end of the housing. Contained within the clamp housing is a substantially rigid, electrically insulating base plate positioned at a lower end of the clamp housing. The upper surface of the base plate includes a depression which contains an insert fabricated either from an elastomeric material or a semiconductor material, such as silicon. A flexible, electrically insulating layer made from, for example, polyimide, overlies the base plate and insert. Significantly, the upper surface of the flexible, electrically insulating layer includes a plurality of dendritic contacts. It is through these dendritic contacts that electrical contact is made to the contact pads of a wire bond-type semiconductor chip.

REFERENCES:
patent: 4597617 (1986-07-01), Enochs
patent: 4783719 (1988-11-01), Jamison et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5402077 (1995-03-01), Agahdel et al.
patent: 5468157 (1995-11-01), Roebuck et al.
"New Products Test Interposer"; Research Disclosure; #30956; Jan. 1990.
"Decal Contactor with Decoder"; Research Disclosure; #32636; Jun. 1991.

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