Apparatus, and corresponding method, for stress testing semicond

Details Apparatus, and corresponding method, for stress testing semicond Apparatus, and corresponding method, for stress testing semicond

1994-12-21

1997-02-18

Regan, Maura K.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439 66, 361760, 324765, H05K 500, H01R 909

Patent

active

056044453

ABSTRACT:
An apparatus, and a corresponding method, for stress testing both wire bond-type semiconductor chips and C4-type semiconductor chips is disclosed.

REFERENCES:
patent: 4150420 (1979-04-01), Berg
patent: 4597617 (1986-07-01), Enochs
patent: 4618739 (1986-10-01), Theobald
patent: 4878846 (1989-11-01), Schroeder
patent: 4969828 (1990-11-01), Bright et al.
patent: 5176524 (1993-01-01), Mizuno et al.
patent: 5276961 (1994-01-01), Matta et al.
patent: 5297967 (1994-03-01), Baumberger et al.
IBM TDB, vol. 10, No. 10, Mar. 1968; "Film Supported Probe For the AC Pulse Testing Of Integrated Circuits".
IBM TDB, vol. 36, No. 10, Oct. 1993; "Flip Chip Burn-In Socket".
IBM TDB, vol. 36, No. 12, Dec. 1993; "Socketed Package for Surface Mount Applications".

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