Incremental printing of symbolic information – Ink jet – Ejector mechanism
Patent
1997-11-19
2000-10-10
Barlow, John
Incremental printing of symbolic information
Ink jet
Ejector mechanism
B41J 204
Patent
active
061306894
ABSTRACT:
In an apparatus and method for injecting a recording solution of a print head, a second thin film capable of regulating deforming quantity and buckling force of a vibration plate is coupled to a thin film shape memory alloy by using a semiconductor thin film fabricating process to increase the buckling force when the thin film shape memory alloy is cooled down to be buckled to its initial bending-deformed state. Thus, the time taken for buckling to the bending-deformed state of the vibration plate after injecting the recording solution is reduced and the operating frequency is increased to heighten printing speed, and rigidity of the vibration plate is heightened to reduce a concern about a damage by an external shock. The apparatus includes vibration plates having a thin film shape memory alloy of a shape memory alloy phase-transformed by a temperature variation and at least one second thin film coupled to the thin film shape memory alloy for regulating the phase transforming quantity, an electric power supply section for inciting the temperature variation of the thin film shape memory alloy, a passage plate is installed over the thin film shape memory alloy while being formed with liquid chambers for retaining the recording solution and a feed path in one sides of wall planes surrounding the liquid chambers for introducing the recording solution, and a nozzle plate installed over the passage plate and formed with nozzles smaller than the liquid chambers of the passage plate for injecting the recording solution in the form of droplet when the phase of the vibration plate is transformed.
REFERENCES:
patent: 5622897 (1997-04-01), Hayes
patent: 5804083 (1998-09-01), Ishii et al.
Hirata et al., "An ink-jet Head using Diaphragm Microactuator", Jun. 1996 IEEE.
Barlow John
Gordon Raquel Yvette
Samsung Electro-Mechanics Co. Ltd.
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