Apparatus and a method of mounting electronic components

Details Apparatus and a method of mounting electronic components Apparatus and a method of mounting electronic components

1998-11-20

1999-11-30

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29712, 29720, 29832, H05K 330

Patent

active

059920130

ABSTRACT:
An apparatus and method for mounting electronic components in which mounting positions are determined by observing identification marks A, B, C and D on a substrate with a camera. The electronic components are mounted on the substrate by correcting programmed data according to the result of the determination of the mounting positions. Correction values are obtained for coordinates of the mounting position with reference to each of a plurality of combinations of any three positions (e.g. A, B and C) selected among the at least four positions of the identification marks A, B, C and D based on coordinate data of the three selected positions before and after deformation (one based on the design data and the other based on the data determined during mounting process). A correction of the programmed data for coordinates of the mounting position is made using a positional correction value, which is a mean value of the correction values.

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