Metal founding – Process – Shaping liquid metal against a forming surface
Patent
1983-10-26
1984-07-03
Lin, Kuang Y.
Metal founding
Process
Shaping liquid metal against a forming surface
164504, 164418, 164459, B22D 2702
Patent
active
044573553
ABSTRACT:
An apparatus and a method for forming a semi-solid thixotropic slurry. The apparatus includes a duplex mold arrangement for postponing solidification within the mold until the molten metal is within a magnetic field for providing magnetohydrodynamic stirring. The duplex mold includes a first portion of low thermal conductivity and a second portion of high conductivity.
REFERENCES:
patent: 2672665 (1954-03-01), Gardner et al.
patent: 2963758 (1960-12-01), Pestel et al.
patent: 3954455 (1976-05-01), Flemings et al.
patent: 4229210 (1980-10-01), Winter et al.
Dantzig Jonathan A.
Tyler Derek E.
Winter Joseph
Holt Harold J.
International Telephone and Telegraph Corporation
Lin Kuang Y.
Raden James B.
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